Company Profile
BJRD
Since 2016 .
Hebei Huibo Technology takes "making all grinding processes easy" as its main purpose. Based on the in-depth interpretation of the application site, innovative abrasive tool design and practical application of grinding system methodology, Huibo adheres to the advanced grinding concept and practices in the semiconductor, automotive parts and other industries, providing high-end abrasive tool products and "cutting, grinding, drilling, polishing" system solutions, which are widely used in the fields of wafer and packaging substrate dicing, microcrystalline glass and functional ceramic grinding, and precision grinding of automotive parts.。
- The R&D team has deep expertise in the field of grinding and cutting.
Focus: A high-tech company dedicated to research, development, production and sales
The limit of grinding
Support Experience
Focus on high-precision cutting technology
Provide customers with high-quality cutting products and services
Get a QuoteThese industries use our products
Choose the most suitable cutting and grinding tools according to your industry
Semiconductor
In circuit board manufacturing, cutting blades are used to cut circuit boards or separate multi-layer boards.
Electronics
In printed circuit board manufacturing, dicing blades are used to cut circuit boards or separate multilayer boards.
Photovoltaic
Scribe blades are used to cut silicon wafers or other photovoltaic materials to make solar cells.
Scientific
In the laboratory, dicing knives are used for sample preparation such as cutting semiconductors, ceramics and other materials.
Glass/ceramics
Used for cutting brittle materials such as liquid crystal display (LCD) glass, cover glass, optical glass, etc.
Optical components
A cutting blade is used in the field of optics to cut optical materials such as lenses, prisms, filters, etc.
What products and services can we provide
We focus on high-precision industry cutting research and development
A variety of product support options
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Resin soft knife
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Metal soft knife
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Electroplate knife
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Hub type hard knife
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Trimming board
Resin bond cutting discs
This series of products is made of thermosetting resin powder as a binder and diamond by hot pressing. It has good self sharpening and excellent cutting ability. According to the advantages of the binder, combined with the adjustment of different concentrations of abrasives, it can effectively control the cutting quality. The variety of binders is rich, and the original material mixing process can realize the uniform dispersion of nano materials, no agglomeration, no agglomeration, and the uniform distribution of diamond, It can be used for precision cutting of glass, ceramics, QFN, DFN, BGA, LGA and other different materials.
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- New bonding agents that meet various needs can be developed in accordance with the characteristics of the processed materials
- Customers can customize dicing knives of different specifications according to their needs. At the same time, by adjusting the concentration, the processing quality and service life can be effectively controlled.
- New mixing and hot pressing technology ensures stable product quality
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Why you should choose our abrasive cutting products
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Consult suitable grinding and cutting tools
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Our professional technical team will provide appropriate grinding and cutting tool solutions according to your industry and purpose
Latest News
We learn from these latest news
Wafer Blade: Key Tools and Technical Analysis for Precision Cutting
1. Definition and Function of Wafer Dicing Blade Wafer Dicing Blade is a core cutting tool in semiconductor manufacturin......
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The resin cutting knife industry is experiencing technological upgrades
In recent years, with the rapid development of industries such as semiconductors......
